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内容説明 This book is divided into four main parts. The first section (10% of the text) offers an introduction to the subject of failure analysis (FA)， describing the history as well as the new challenges in reliability testing， such as its use in microsystems and nanostructures. The second part discusses why failure analysis should be used with electronic components. Failure modes and mechanisms are looked at in detail， along with reliability physics and the failure analysis of materials. This section presents eight main reasons why FA is an important tool for improving yield and reliability by corrective actions. It explains a synergetic approach， emphasizing the cooperation needed between a whole team involved in developing a new product. The third section explains the appropriate moments for implementing FA. It starts at design stage， highlighting the ‘concurrent engineering’ approach and DfR (Design for Reliability). FA during fabrication is explained， covering reliability monitoring， process monitors and package reliability. Reliability resting after fabrication is discussed here also. Reliability assessment at this stage and corrective actions are presented. Methods on how to use FA can be found in the fourth part of the book. The importance of this section can be seen in the large variety of methods described. Among others， the following are covered: electrical methods， thermal methods， optical methods， electron microscopy， mechanical methods， X-Ray methods， spectroscopic， acoustical， and laser methods. The results obtained by using such methods are also presented. Twelve complex case studies covering the main technologies and various FA methods are given an entire chapter. Part six of the book concludes with a round-up of the benefits of FA， adding to a reference book that will prove of great importance to anyone involved in the design， fabrication and testing of electronic components.